Shanghai Daoqin Plastics Co., Ltd.

1． material tube/pipe temperature degree low

material tube/pipe temperature degree low 时, melt temperature degree low, strong/high high speed formed 形时, 残余剪切应 force large, also has time will residual stress 释放, easy warpage.

improve/increase material temperature, warpage decrease/reduce. material temperature setting can 参考材 material 厂商 建议. material tube/pipe separation rear, in, front, nozzle 四区, from rear front material temperature setting 应逐步 improve/increase, front 一区, increase high 6C. has necessary, has 时, will nozzle or front material temperature setting and in 区 一样. CAE（如C-MOLD）模拟 can different material temperature property.

2． nozzle temperature degree low

plastics in material tube/pipe inner absorption add hot belt/tape hot amount and screw 转动引起 plastics separation versus for generate abrasion scratch hot, temperature degree rise high. material tube/pipe in most rear add hot is nozzle, melt to 此应该达 to material temperature, must degree add hot, maintain most 挂状态. if nozzle temperature degree setting high, nozzle and mold belt/tape hot more, material temperature drop lower, strong/high high speed formed 形时, 残余剪切应 force large, also has time will residual stress 释放, easy warpage. generally will nozzle temperature degree setting ratio front temperature degree high 6C. CAE（如C-MOLD）模拟 can different nozzle temperature degree property.

3． melt temperature degree low or / and injection shot pressure high

melt temperature degree and injection shot pressure is plastics formed process in for warpage effect/influence relatively large parameters. melt temperature degree low or / and pressure high generate high residual stress, easy warpage. need decrease/reduce warpage, melt temperature degree need in can use scope/range inner to most high, injection shot pressure need in can scope/range inner to most low. CAE（如C-MOLD）模拟, can 帮助找出 melt temperature degree and injection shot pressure most combined.

4． holding pressure pressure or holding pressure time 不当

holding pressure pressure high, not only 因补充 material flow cold plastics 残余剪切应 force high, but also plastics pressure force high, easy warpage.

holding pressure pressure low, gate 附近发生回流, not only generate flow cold plastics 残余剪切应 force, but also due to products in 央体积 shrinkage rate large （ low pressure 故）, outer 围体积 shrinkage rate small, inner outer shrinkage rate large generate 残余张, pressure force large, easy warpage. screw to rear, screw less 停留2秒, maintain 缓充.

holding pressure time short, screw 松退时 gate 附近发生回流, residual stress large, easy warpage. holding pressure pressure need in, holding pressure time need long to gate solid is 止.

CAE（如C-MOLD） 输出 in 包含 凝 solid ratio 剪切应 force, shrinkage rate. gate solid 时, solid ratio formed 1, 剪切应 force formed 0, shrinkage rate formed 常数, this parameters and can 帮我们判定 gate 何时凝 solid, 以选定 most holding pressure time.

5． 停留 time 不当

停留 time short, melt temperature degree low, make strong/high will 模穴填满, holding pressure also is method will plastics pressure 实, cooling 时回旋空间太 large, easy warpage.
射 material for material tube/pipe material ratio, in 1/1.5 and 1/4 between.

6． 循 ring time 不当

当 cooling time short 时, plastics soft, by ejection, in has 约束 状况 lower shrinkage, easy warpage. cooling time must long to plastics type to 足够坚 strong/high is 止; is most good Fixture, provide most combined 身 约束. CAE（如C-MOLD）模拟, can forecast plastics temperature degree drop to ejection temperature degree must need cooling time. cooling time setting, can 避免因循 ring time short 而引起 warpage.

7． 缓充不够

缓充不够时, inner plastics pressure 不足. plastics in versus for 松退 情况 lower cooling, 回旋空间太 large, easy warpage. screw to rear, less 停留原处2秒, maintain 缓充, most less need has 3mm long.

mold
1． 公, mold temperature large

公母 mold temperature large, cooling generate 残余剪 force for thick in 心面不 for 称, bending force large, easy warpage.

more cooling design, decrease/reduce 公, mold temperature 差, can decrease/reduce warpage. CAE（如C-MOLD）模拟, can 帮助找出公, mold temperature most small cooling design.

2． mold temperature low

mold temperature low, 残余剪切应 force large, also has time will residual stress 释放, easy warpage. improve/increase mold temperature, can decrease/reduce warpage.

mold temperature can from material 厂商 建议 value setting. adjustment increase amount is 6C, 射胶10次, formed 形情况 stability rear, according to 结果, is 否进一步 adjustment.

CAE（如C-MOLD）模拟 can different mold temperature property.

3． 模穴 thick, thin 差异太 large

this and products design has 关, thin cold, thick rear cold. thick thin large 时, shrinkage rate large, residual stress large. residual stress parts strong/high degree, generate warpage. Shrinkage Fixture or can 治标, can 治本. is Fixture无 method remove residual stress. products high temperature or other poor ring lower, residual stress 会释放出, warpage also is has can can generate. 治本之计 is as good products design, make products thick degree 均一, cooling 时体积 shrinkage rate small, residual stress small, warpage small. CAE（如C-MOLD）模拟, can residual stress most small products design.

4． gate or 位置不当

无论 gate or 位置不当, make long long, retardant large, versus 应 射 pressure must improve/increase, plastics separation by tensile, pressure 挤, machine force strong/high add 入, residual stress large, easy warpage. gate pressure high, plastics shrinkage rate small, most rear 充填处 pressure low, plastics shrinkage rate large, long long 时, upstream and downstream plastics shrinkage rate large, residual stress large, easy warpage. 参考材 material 厂商 建议, using/adopting 适当 流 long thick degree ratio. gate 位置 决定, need 遵循充填均衡 原则;

即各 melt front to 达模穴末端 and formed combined time basic 一致. 充填应先 thick rear thin, rear 弯. 进浇应 let melt 胶遭遇立即 retardant 挡以避免喷流. this can reduce residual stress, decrease/reduce warpage. 以CAE（如C-MOLD） in electrical upper for different gate design 进行模拟 analysis, gate most 佳数目 and is as method.

5． gate (Sprue), runner (Runner) or / and gate (Gate)太 small or / and long

浇道, runner or / and gate small or / and long, retardant improve/increase, pressure must versus improve/increase, plastics separation by 位伸, pressure 挤, machine force strong/high add 入, residual stress large, easy warpage. 以CAE（如C-MOLD） in electrical upper for different melt 胶传送 system （包括浇道, runner, gate and 模穴） 充填, holding pressure, cooling and shrinkage bending 进行模拟 analysis, 找出并 selection warpage most small design is has as method.

6． ejection 不均

ejection products hot, ejection 不直, 不均, 不一致, products easy warpage. ejection system, as necessary adjustment. degree lubricated has parts. large mold ejection sheet/plate must using/adopting 引导櫬 sleeve/set, 以免模 sheet/plate in 央因自 heavy lower 垂.

plastics

1． flow property 不佳

thin housing/shell formed 形时, selection easy flow plastics is very 自然. is easy flow plastics 往往不够坚 strong/high, residual stress make very large, has can can formed warpage. selection plastics 应以容 easy 流但不会溢 material is 准. can 参考材 material 厂商 建议. CAE（如C-MOLD）模拟 can 验证提议 plastics can will formed warpage most small products.

2． 操 as 员习惯不 good

ejection products, as 员不照规定置放, has can can generate warpage.

平常应该不断 教育操 as 员, let large understanding maintain good formed as important property, formed ring 不一致 can can formed heavy rear 果.

操 as 员 轮班休息应该 combined 理, 以免体 force 不继, 精神不集 in, formed 失误.

using/adopting machine and other 进行自动化 is maintain formed ring 一致 一 strip/profile 路.