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full 球3D structure electronics 崛起 new trend:模 inner electronics value will 逾10 100 million USD

Date: 2020-05-26 05:16 Views: 1913 Source: Internet

         according to IDTechEx research report, inner electronics (IME) or inner structure electronics (IMSE)即 will 步入, fast speed growth 期, forecast to 2029 year overall value will ultra- 11.1 100 million USD.

        模 inner electronics (IME) is 传统模 inner injection molding decoration (IMD) technology and flexible made electrical 路 结 combined, can made belt/tape has different complex degree 嵌入式 electrical 路 3D形状.

         this is full 球3D structure electronics trend separation, 透 模 inner electronics technology, 无需组装 and outer housing/shell 封装, can production can property more high product.

        模 inner electronics advantages 包括: light 巧, 节省空间, solid resistant use, product cycle short and high amount can force. is, technology in 一 局限 property, 例如形状限 made, yield rate, soft parts formed 熟, ring stability property and rear issues.

        模 inner electronics type types type more, from can technology simple equipment, automotive inner 装, and white home appliances 触摸面 sheet/plate to more complex device, device and device and other.

        IME并 non 3D electronics product technology solutions. gas solvent 胶喷射 printing, mold equipment (包括激 light molding, injection molding and film 插入)以 and 3D printing electronics product in speed 兴起并引起关注.

         application market outlook/prospects

        IDTechEx expected, inner electronics short inner main applications in electronics and other product more new comparison fast industry. in in inner, automotive inner application will provide most large market amount.

         from long 远 看, inner electronics not only application to price more 实惠 交通工 tool in, also has application to more more day equipment in, 包括家 use electrical appliances and white home appliances and other.