Shanghai Daoqin Plastics Co., Ltd.

        5G

        5G通讯 is semi 导体材 material and device parts, achieve electrical magnetic 波远距离传输, 收发, 处理 通信 technology.

         versus ratio 传统4G and other technology, 5G需符 combined full frequency 谱接入, high frequency 段乃至 mm 波传输, high frequency efficiency large property can requirements, therefore for device parts Raw Materials 也提出 more high property can and rise grade demand, large 规模集 formed 化, material tool has high dielectric constant and low dielectric loss, and material tool has high electronics rate and other.

         according to IHS research machine forecast, to 2035 year, mono mono 5G industry will to 3.5万 100 million USD 经济输出, will 创造2200万 工 as 岗位.

         more value is, 5G will is full more industry sales active 动创造达12.3万 100 million USD value, this will full sales active 动 4% 价 value !

         which polymer/macromolecule material more 受欢迎?

        5G时代

         PTFE

        极佳 high frequency PCB sheet/plate material

         high frequency PCB sheet/plate for material property can requirements dielectric constant (Dk)必 must small but also very stability, and copper thermal expansion coefficient amount 一致.

         meanwhile water property need low, 否则受潮时会 effect/influence dielectric constant and loss consumption. another heat resistant property, resistant chemical property, impact strong/high degree, strong/high degree and other must good.

         thermoplastic property material PTFE (PTFE) tool has high temperature resistance features, use as temperature degree 达250℃. in relatively wide frequency rate scope/range inner dielectric constant and dielectric loss very low, but also dielectric breakdown voltage, volume resistivity and resistant electrical property relatively high, is PCB sheet/plate material.

        PTFE also can through various filler glass fiber or 陶瓷材 material add solid reinforcement and can improvement material thermal expansion coefficient, material tool PTFE材 material tool has low temperature degree features and electrical features, non combined high frequency mm more sheet/plate application.

        手 machine 天线

        LCP liquid crystal polymer (LCP) formed new 宠

         as is 无线通信 important ring, technology new is 推动无线连接 development key/critical force. 随 5G and material 联网时代 规模部署, in 5G网络 in function will 越 越 important, development outlook/prospects sheet/slice large good.

        以智 can machine is 例, due to industry and market development, 随 手 machine appearance design 一体化 and high degree formed 化, internal 空间不断 decrease/reduce, this for/regarding design can is high difficult degree.

手 machine upper more device parts need use to soft sheet/plate 连接 | 图1

        手 machine already from outer 置天线 development is inner 置天线, meanwhile soft sheet/plate already formed is process, ultra- 7 formed.

        就 currently 而言, machine soft sheet/plate main/primary is PI, 但鉴于 PI基材 dielectric constant and loss consumption relatively large, 且吸潮 property relatively large, high frequency loss consumption heavy and structure features relatively 差, its can very good meet/satisfy 5G for material property can demand.

        随 5G科技 to, LCP(industrial liquid crystal polymer (LCP)) formed is types 理想天线材 material. it is 80 year 代初期 development 起 一 types new type high property can specialty engineering plastics, in melt generally liquid property.

LCP | 图2

        LCP tool has ultra- 卓 electrical insulation property can, its electrical strong/high degree high generally engineering plastics, resistant electrical property good. make use temperature degree 200-300℃, 也不会 effect/influence its electrical property can. use temperature degree more high 达316℃ left right!

         versus ratio PI, LCP材 material loss consumption and loss consumption more small, more tool active property and property, in manufacturing high frequency device parts application outlook/prospects can 观. 随 4G toward high frequency high speed 5G网络迈进, LCP也 has formed is substitute/replace PI new soft sheet/plate process.

        举 例子, launch iPhoneX就首次 using/adopting more 层Liquid Crystal Polymer天线, 而iPhone XS/XS Max/XR均 use more 根LCP天线.

         in upper production 方面, main/primary production 商包括Du Pont, Ticona, Sumitomo, Polyplastics plastics, Toray and other, Sumitomo as is LCP resin main/primary production 商之一, table/sheet good LCP resin in 5G时代 key/critical application, versus future LCP application 会越 越 important.

        MPI modified polyimide (PI)

        5G手 machine 天线材 material rear 起之秀

        LCP as is machine 天线材 material, although advantages more more, in application in, 也面临不 less 挑战.

        据 outer 媒报道, analysis 师郭明錤 in its has 关2019 year new iPhone report 指出, 鉴于Apple for LCP Raw Materials 供货商议价 force relatively low and new LCP soft sheet/plate 供货商不足 and other factors, 2019 year 苹果手 machine will combined LCP and most new MPI(Modified PI) technology, combined and 推进5G technology.

         that 么MPI also is what 呢?Modified PI its is formulation 经 改进 polyimide (PI) 天线. MPI as is non crystallization property material, as temperature degree wide, in low temperature pressure combined copper lower easy as, surface can easy and copper versus 接, therefore, future MPI材 material can can formed is 5G equipment large 受欢迎材 material.

        天线罩:

         multiple resin 基体派 upper use 场

         due to 5G天线遵循MIMO(Multiple-Input Multiple-Output) concept, is more more 输出, this 意味 一 基站 inner can more 天线, this dimensions also very small, need 天线罩 保护.

        天线罩 need tool has good electrical magnetic 波穿透 features, mechanical properties upper need can external poor ring 境 侵蚀如暴风雨, 冰雪, 沙尘以 and cationic and other.

         in material requirements 方面, requirements in as frequency rate lower dielectric constant and loss consumption positive need low, and need has machine strong/high degree.

         generally 而言, gas 天线罩 commonly used coating has 海帕龙橡胶 or chlorine 丁橡胶 polyester fiber film; rigid property 天线罩 use glass fiber reinforcement plastics;夹层 structure in more use 蜂窝状芯子 or foam plastics.

        而 in 5G trend lower, property can excellent composite/compounding material formed is 备受欢迎 天线 outer material. composite/compounding material can to insulation anti 腐, anti 雷, resistant dry 扰, resistant use and other function, but also 透波效果 non good.

        透波 composite/compounding material reinforcement fiber and resin 基体构 formed, usually, reinforcement material force property can and electrical features excellent resin 基体, composite/compounding material property can main/primary 取决于 resin property can.

         therefore, selection tool has excellent electrical property can resin 基体至关 important, meanwhile resin in composite/compounding material in 也起胶 viscous agent function, is composite/compounding material heat resistant property basic formed separation.

         resin main/primary selection 包括:

        传统 不 saturated and polyester resin (UP), ring oxygen resin (EP), modified aldehyde resin (PF)以 and in recent years research and application acid ester resin (CE), has machine silicon resin, di 马 酰亚 amine resin (BMI), polyimide (PI) (PI), PTFE (PTFE) and other new type high temperature resistance resin.

        PC/PMMA plastics composite/compounding material

        5G时代手 machine rear cover/cap 之选

        5G时代, for 5G application equipment material more requirements. due to 5G走 is for metal mm 波, use metal outer housing/shell will 会屏蔽信号. machine material is 例, 5G conditions lower metal already formed is types trend.

        而趋 toward use material has 玻璃, and composite/compounding sheet/plate and other non metal material, 例如, plastics composite/compounding material excellent property can, formed is machine rear cover/cap selection.

        当 in, most hot need 数PC/PMMA composite/compounding sheet/plate 材. this type of material is will PMMA and PC through 共挤(non alloy material) made, 包括PMMA层 and PC层.

        PMMA层 add hard rear can to 4H above hardness, ensure product resistant scratch property can, 而PC层 can ensure its tool has tough property, ensure overall impact strong/high degree.

        石墨烯

        理想 5G equipment thermally conductive dispersion hot material

         high frequency rate, hard parts parts rise grade and equipment and 天线数 amount formed growth, equipment and equipment between and equipment internal electrical magnetic dry 扰无处不 in, electrical magnetic dry and electrical magnetic for electronics equipment 危害也 day heavy.

         and meanwhile, electronics product more new rise grade, equipment consumption increase large, hot amount 也随之 fast speed upper rise.

         future high frequency rate high rate electronics product need force solution its generate electrical magnetic and hot.

         is 此, electronics product in design will add 入越 越 more EMI shielding and thermally conductive device parts. therefore EMI shielding and dispersion hot material and device parts function will important, future demand will growth.

        以 thermally conductive 石墨烯 is 例, 5G手 machine has in more more key/critical parts using/adopting made thermally conductive 石墨烯 solution/scheme, meanwhile composite/compounding type and more high thermally conductive film due to tool more excellent dispersion hot 效果而 will by more more using/adopting.