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SDK development 出直接连接/ bonding aluminum alloy and polycarbonate (PC) resin technology
昭 and electrical 工(SDK) development types innovation technology, can will aluminum alloy and polycarbonate (PC) resin 连接/ bonding technology, process in need use bonding agent.

usually aluminum alloy and polycarbonate (PC) resin is machine 械连接(use and other) or bonding agent (use bonding agent)连接/ bonding. in recent years, will attention/notes force in in resin material injection molding 时直接连接/ viscous alloy material new technology upper. this new technology has process/workflow, improve/increase production rate, processing formed complex 形状 潜 force. however, many lower, it 们依赖于 machine bonding force, 例如由 resin coarse metal surface generate solid 效应. therefore, generally is polycarbonate (PC) resin (and its it non crystallization engineering plastics)不适 combined through methods 连接/ viscous alloy material.
SDK凭借 its more year in aluminum alloy and polymer chemical 方面 专业 Knowledge, achieve this type of 直接连接/ bonding. specific 说, SDK development types aluminum alloy surface treatment and 底漆处理 innovation 连接/ bonding technology. this technology remove to solid outer also achieve chemical combined can force. table/sheet 明, new technology can polycarbonate (PC) molding conditions lower use, provide ultra- 25MPa can bonding strong/high degree. in ensure bonding strong/high degree meanwhile need conditions or equipment.
该 technology can 够直接接 combined / bonding product polycarbonate (PC) resin and light aluminum, therefore suitable for can machine outer housing/shell. SDK will development optimization its aluminum surface treatment technology and coating conditions, from improve/increase bonding strong/high degree and resistant property. future, SDK will force in automotive parts application in use more high heat resistant property ultra- grade engineering plastics technology.
in SDK in business plan “TOP 2021” in, SDK positive in promote business between combined as add strong/high 营销. automotive and electronics equipment industrial for multiple complex material demand day growth. this material very light and has more good dispersion hot, hot and insulation features. this type of market demand, SDK positive in force through combined its more technology development composite/compounding material. this 次公布 metal / resin 直接连接/ bonding technology is this 方面努 force 一 例子.
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