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PS injection molding parts conductive specialized material formulation
Date: 2019-11-25 03:40
Views: 2325
Source: Internet
formulation formed （ quality separation 数）: HIPS 59% 炭黑（特导） 7% SBS 15% PE wax 3% hard ester acid zinc 1% compatibilizer 7% active carbon acid 钙 8% （ above formulation 仅供参考）
