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Three Applications of Low Pressure Injection Molding
Date: 2019-06-27 09:23
Views: 4465
Source: Internet
一, what is low pressure injection molding process?
low pressure injection molding process is types use very low injection molding pressure will hot material mold fast speed solid 化 封装 process, hot material 卓越 密封 property and excellent material 理, chemical property can to insulation, resistant temperature, impact resistant, decrease 振, anti 潮, anti water, anti 尘, chemical resistant and other 功效, for electronics parts to good function. and 传统 灌封 process （如 di ring oxygen resin or silicon ketone 灌封） versus ratio, low pressure injection molding process not only tool has environmental protection property, meanwhile large degree improve/increase production efficiency can reduce production cost.
二, low pressure injection molding process types main applications
generally use low pressure molding process in in has PCBA,极 fine welding, strong/high degree low connectors molding and other.
1, electronics device parts 封装
诸如 belt/tape PCB automotive electronics product, belt/tape connectors PCB, belt/tape PCB and other, in injection molding process in using/adopting low pressure, can anti loss bad electronics device parts. types material can electronics device parts external ring effect/influence （如 water 汽, machine force and other ）, but also can 够充当 outer housing/shell.
2, connectors anti water 密封
using/adopting hot melt adhesive 密封插头以 and cable 卡子. KY low pressure injection molding material flexibility property make rear connectors can more good remove force, its bonding property can to water property.
3, injection molding made as ring
can will low pressure injection molding process used for ring made as. fast speed molding, force 缓冲, 保护线束. 克服 穿索 ring process in consumption time, improve/increase production process.
部 separation application areas brief introduction:
1, automotive electronics product
a. anti water connectors b. micro 动开关
c. full degree device d. can battery device
e. gas quality device f. temperature degree device
g. other types type device h. 天线线圈
i. 接 端子
2, machine type product
a. PCB包封
b. 索眼/插孔
c. anti water and 应变释放 molding parts /传感 device
low pressure injection molding process is types use very low injection molding pressure will hot material mold fast speed solid 化 封装 process, hot material 卓越 密封 property and excellent material 理, chemical property can to insulation, resistant temperature, impact resistant, decrease 振, anti 潮, anti water, anti 尘, chemical resistant and other 功效, for electronics parts to good function. and 传统 灌封 process （如 di ring oxygen resin or silicon ketone 灌封） versus ratio, low pressure injection molding process not only tool has environmental protection property, meanwhile large degree improve/increase production efficiency can reduce production cost.
二, low pressure injection molding process types main applications
generally use low pressure molding process in in has PCBA,极 fine welding, strong/high degree low connectors molding and other.
1, electronics device parts 封装
诸如 belt/tape PCB automotive electronics product, belt/tape connectors PCB, belt/tape PCB and other, in injection molding process in using/adopting low pressure, can anti loss bad electronics device parts. types material can electronics device parts external ring effect/influence （如 water 汽, machine force and other ）, but also can 够充当 outer housing/shell.
2, connectors anti water 密封
using/adopting hot melt adhesive 密封插头以 and cable 卡子. KY low pressure injection molding material flexibility property make rear connectors can more good remove force, its bonding property can to water property.
3, injection molding made as ring
can will low pressure injection molding process used for ring made as. fast speed molding, force 缓冲, 保护线束. 克服 穿索 ring process in consumption time, improve/increase production process.
部 separation application areas brief introduction:
1, automotive electronics product
a. anti water connectors b. micro 动开关
c. full degree device d. can battery device
e. gas quality device f. temperature degree device
g. other types type device h. 天线线圈
i. 接 端子
2, machine type product
a. PCB包封
b. 索眼/插孔
c. anti water and 应变释放 molding parts /传感 device
