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BASF technology can relatively low temperature in flexible film upper achieve semi 导体
早 front, Korea parts and device industry enterprise CLAP and full chemical industry company BASF (BASF) in Korea 首尔签订 Organic Semiconductor InkSet technology let combined 同.
继今 year 6 month and BASF (BASF)签订 liquid material is optical film technology (Patterned Retarder)转 let combined rear, through 本次签订Organic Semiconductor InkSet technology let combined 同, CLAP will again solid parts and device industry as is has patent and material technology enterprise 位.
BASF (BASF) will 经 15 year development Organic Semiconductor InkSet原始 patent 权出售 to CLAP并 meanwhile let material production technology. reinforcement 伙伴关系 is label combined 同, BASF (BASF) also will acquisition CLAP separation corporation.
Organic Semiconductor InkSet material technology can in large gas pressure lower utilizing simple coating process made as semi electrical 路. use patent technology can in 100摄氏 degree below/following relatively low temperature degree in flexible film upper achieve semi electrical made as, can large production.
in addition, utilizing Organic Semiconductor InkSet材 material made as OTFT (Organic Thin Film Transistor) and machine material is Oxide TFT versus ratio, tool has low 关断漏 electrical (Low off Leakage current) and fast speed pressure force 恢复(Fast bias stress recovery) features. therefore technology most combined used for need high stability property machine large 屏幕FOD传感 device, IoT传感 device and Bio传感 device.
CLAP will through combined BASF (BASF) liquid optical film technology and Organic Semonductor InkSet technology, in short time inner achieve flexible 显示屏 FOD (Fingerprint On Display) device product 化.
FOD屏幕指纹以FOD Module出货 amount is 基准, expected will from 2019 year 2 100 million increase 至2023 year 6 100 million 台, market will growth 至3倍. (以2019 year IHS Markit published material is 准)
CLAP CEO 金星虎 table/sheet 示: “ using/adopting liquid optical film technology and Organic Semiconductor InkSet technology can achieve above 手指指纹缝纫 comprehensive FOD传感 device product 化. will flexible 显示屏 FOD product 化, in machine market is 指纹识别 safety property most large 化做出贡献. ”CLAP is innovation type material enterprise, has device and device field/area core technology, will in future is and market 不断创造革 new value.
